Dental Universal Light Cure Adhesive 8th Generation 6ml/Bottle. 8th Generation Bonding. No primer needed. Achieves high-strength, durable adhesion in one step. Fully compatible with self-etch, selective-etch, and total-etch techniques.
- 8th Generation Bonding
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FliPro is a one-component self-etch light-cure dental adhesive featuring an innovative flip-open cap design, delivering a better and easier operative experience. As the latest (8th) generation self-etch adhesive, it is compatible with total-etch and selective-etch techniques, widely used in both direct and indirect restorations, and is characterized by high bonding strength, user-friendly application, and excellent biocompatibility.
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- Direct bonding of restorations made of metal, ceramic, zirconia, composite, etc.
- Cementation of orthodontic bands.
- Direct bonding under light-cured composite resin or compomer fillings.
- Repair dental restorations of ceramic, composites or metal alloys, used with light cure composite resin.
- Used with resin cement.
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One Bottle, Strong Bond: No primer needed. Achieves high-strength, durable adhesion in one step.
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Universal Etching Compatibility: Fully compatible with self-etch, selective-etch, and total-etch techniques.
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MDP Formula for Versatile Bonding: MDP technology ensures reliable adhesion to enamel, dentin, zirconia, metals, and composite.
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Thin Film, High Penetration: 3μm film thickness with strong dentinal tubule penetration. Bond strength ≥20 MPa.
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Reduced Sensitivity & Microleakage: Minimal postoperative sensitivity. Low microleakage helps prevent secondary caries.
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- Product: Generation Universal Light Cure Adhesives
- Type:8th
- Etching Techniques: self-etch, selective etch, total-etch
- Spec: 6ml
- Shelf life: 2 years
- package size: 6.8*4.8*4.8cm
- package weight: 25g
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